Zero-Temperature-Coefficient (ZTC) is the point at which the performance of a transistor becomes independent of temperature changes. Normally, when the temperature increases, we see two main effects: the…
The Narrow-Channel Effect refers to a phenomenon where the threshold voltage (VT) of a MOSFET increases as the width of the channel becomes smaller. This happens because, as…
When it comes to N-PLUS (NMOS Source-Drain) or NSD and P-PLUS (PMOS Source-Drain) or PSD masks, you might wonder why these are necessary in the process of fabricating…
You should choose the Damascene process with CMP if you need to fully address step formation across the entire wafer. I find that spin-on glass is useful but…
We rely on the Damascene process and CMP because it solves step formation problems much more effectively than spin-on glass. The Damascene process involves etching trenches, filling them…
Spin-on Glass is used for smoothing aluminum features and can be applied at room temperature, but it only addresses local rough spots. We use it because it’s simpler…
You have to consider that in chip fabrication, material choice isn’t just about conductivity. We, as designers, have to think about current-carrying capacity, corrosion resistance, and even mechanical…
When we talk about the shift from aluminum to copper for interconnects, it’s mostly about performance and practicality. We see aluminum being good for conductivity and stability, but…
I think it’s important to understand that each metallization layer in chip design has specific requirements to ensure efficient routing. For every routing layer, there are two corresponding…
In semiconductor manufacturing, you might have come across the term “STI” or Shallow Trench Isolation. I want to share some thoughts on what STI is and why we…