D flip-flop captures the input data (D) only when a clock transition occurs—either on the rising edge…
In VLSI layout, CPODE stands for Continuous Poly on Diffusion Edge. When you work with advanced nodes…
What is CoWoS Technology? When we look at Chip on Wafer on Substrate (CoWoS) technology, we see…
When you work on a VLSI layout, Gradient density DRC refers to the variation in pattern density…
When working with VLSI circuits, one thing you, as a designer, might face is the issue of…
Charge injection in MOSFETs occurs through mechanisms such as Hot electron injection and Fowler–Nordheim tunneling, each with…
HBM (High-Bandwidth Memory) and DDR (Double Data Rate) are both types of DRAM, but they serve different…
When diving into memory layout in 5nm technology, it’s helpful to understand how far we’ve come in…
Drain-Induced Barrier Lowering (DIBL) is a phenomenon observed in short-channel MOS transistors. You can think of it…
When you deal with the etching process, one big challenge comes from regions with different metal densities….