I think SADP is definitely superior in controlling line patterns. You get a more uniform and conformal deposition with the spacer layer, which is crucial. However, you can't ignore the added process complexity. It makes the overall fabrication process more challenging.(Image source)
I agree that SADP offers better control. But from my experience, the complexity it adds can be a significant drawback. The issues with film thickness and etch uniformity can be pretty problematic, leading to even-odd bias.
Both SADP and LELE, and I have to say, you can't beat the precision of SADP. But you also need to consider the extra steps involved. You have to manage the sacrificial core formation, spacer deposition, and multiple etch steps, which adds to the workload.
While SADP is great for precise patterning, the additional steps make it less appealing. You need to control a lot more variables, and that can introduce more points of failure in the process.
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