Cut Mask

In the SADP process, we use a cut mask, also known as a block mask, to trim the tips of lines created in the first litho-etch step or to remove dummy lines. You might wonder why this cut mask is necessary. The reason is that the initial step of creating lines often results in extensions that are not needed or dummy lines that can interfere with the design. By using the cut mask, we can precisely define the ends of the functional lines and remove any unnecessary parts. This step is crucial because it ensures that the final pattern is accurate and free of defects that could impact the performance of the semiconductor device.

In summary, we use the cut mask in the SADP process to refine the line ends and eliminate unwanted elements, which helps in achieving a more reliable and precise manufacturing outcome. By understanding the role of the cut mask, you can appreciate how it contributes to minimizing variation and enhancing the overall quality of the semiconductor fabrication process.

Why SADP process is better than LELE?

SADP is an advanced method used in semiconductor manufacturing, distinct from the traditional litho-etch-litho-etch (LELE) process. While LELE uses two masks that need precise alignment, SADP relies on spacers that are self-aligned to the first litho-etch step, reducing the risk of misalignment.