What Is a D Flip-Flop and How Does It Work?
D flip-flop captures the input data (D) only when a clock transition occurs—either on the rising edge (0 to 1) or the falling edge (1 to 0), depending…
What is CPODE, and why do we use it in VLSI layout?
In VLSI layout, CPODE stands for Continuous Poly on Diffusion Edge. When you work with advanced nodes and multi-gate devices like FinFETs and GAA (Gate-All-Around) transistors, scaling becomes…
CoWoS Technology: Why It Matters for You and the Tech Industry
What is CoWoS Technology? When we look at Chip on Wafer on Substrate (CoWoS) technology, we see an innovative way to bridge the gap between traditional 2D designs…
What is Gradient Density in VLSI Layout Design?
When you work on a VLSI layout, Gradient density DRC refers to the variation in pattern density across different regions of the chip. It shows how the density…
Crosstalk in VLSI: Understanding Causes and Proven Reduction Techniques
When working with VLSI circuits, one thing you, as a designer, might face is the issue of crosstalk. We all know that as technology scales down, devices become…
What are the Mechanisms of Charge Injection in MOSFETs
Charge injection in MOSFETs occurs through mechanisms such as Hot electron injection and Fowler–Nordheim tunneling, each with distinct behaviors and implications for n-channel and p-channel devices. Hot Electron…
HBM vs. DDR: Key Differences Explained for High-Performance Computing
HBM (High-Bandwidth Memory) and DDR (Double Data Rate) are both types of DRAM, but they serve different purposes and have significant differences. Let’s break it down in simple…
A Beginner’s Guide to Memory Layout in 5nm Technology
When diving into memory layout in 5nm technology, it’s helpful to understand how far we’ve come in SRAM design and the challenges that come with scaling. In this…
What is Drain-Induced Barrier Lowering (DIBL)?
Drain-Induced Barrier Lowering (DIBL) is a phenomenon observed in short-channel MOS transistors. You can think of it as a reduction in the transistor’s threshold voltage caused by the…
Why do We use Dummy Fill in the Layout Design?
When you deal with the etching process, one big challenge comes from regions with different metal densities. Let me give you an example. In older processes, aluminum was…
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